Funktionsnachweis eines Klebstoffsystems zur inhärenten Strukturüberwachung von strukturellen Klebverbindungen

Kurzfassung

The objective of this work is to determine the effect various metal mesh geometries have on bond strength, as well as determining if damage can be detected and localized within an adhesive layer using resistance measurements. The parameters of open area, wire diameter and wire material were investigated. Open area does not influence bond strength, while there is an inverse relationship between wire diameter and bond strength. The young’s module is directly related to bond strength. The electrical resistance measurements showed that large adhesive, cohesive and mixed damage which covers the area of the entire contact can be identified. The multiplexer system which might be used for the development of a structural health monitoring system was also shown to be able to detect damage, and possible improvements were identified.