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Durability of Co-bonded Piezoelectric Transducers

Moix-Bonet, Maria and Wierach, Peter and Büthe, Inka and Fritzen, C.-P. and Bach, Martin (2014) Durability of Co-bonded Piezoelectric Transducers. In: 2nd International Conference on System-Integrated Intelligence: Challenges for Product and Production Engineering, 15. Procedia Technology. 2nd International Conference on System-Integrated Intelligence: New Challenges for Product and Production Engineering, 02.-04. July 2014, Bremen, Germany.

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Abstract

The Structural Health Monitoring (SHM) technique Acousto Ultrasonics is based on a permanently installed piezoelectric transducer network. A reliable and effective transducer installation procedure shall be developed so that SHM represents a feasible alternative to the currently used Non-Destructive Testing (NDT) in Aircraft. A co-bonding procedure has been considered for transducer installation as a time and cost efficient method, while arising additional requirements regarding the transducer properties and the manufacturing processes. This paper focuses on the mechanical durability of DuraAct™ piezoelectric patch transducers, which have been co-bonded on Carbon-Fiber Reinforced Polymer (CFRP) plates. The samples were tested in quasi-static and cyclic loading conditions at different loading levels. The degradation of the DuraAct™ piezoelectric transducers is assessed by means of three monitoring methods: The electro-mechanical impedance spectrum, the charge issued from the direct piezoelectric effect when the piezoelectric transducers undergo mechanical deformation and the guided ultrasonic waves sent and received by the transducers.

Item URL in elib:https://elib.dlr.de/103380/
Document Type:Conference or Workshop Item (Speech)
Title:Durability of Co-bonded Piezoelectric Transducers
Authors:
AuthorsInstitution or Email of AuthorsAuthor's ORCID iD
Moix-Bonet, MariaDLR-FAUNSPECIFIED
Wierach, PeterFA-MFWUNSPECIFIED
Büthe, InkaUniversity of SiegenUNSPECIFIED
Fritzen, C.-P.University of SiegenUNSPECIFIED
Bach, MartinAirbus Group InnovationsUNSPECIFIED
Date:July 2014
Journal or Publication Title:2nd International Conference on System-Integrated Intelligence: Challenges for Product and Production Engineering
Refereed publication:Yes
Open Access:No
Gold Open Access:No
In SCOPUS:No
In ISI Web of Science:Yes
Volume:15
Editors:
EditorsEmailEditor's ORCID iD
Thoben, Klaus-DieterUNSPECIFIEDUNSPECIFIED
Busse, MatthiasUNSPECIFIEDUNSPECIFIED
Denkena, BerendUNSPECIFIEDUNSPECIFIED
Gausemeier, JürgenUNSPECIFIEDUNSPECIFIED
Publisher:Procedia Technology
Status:Published
Keywords:Structural Health Monitoring; Sensor Faults; PWAS; Electro-Mechanical Impedance; Integrated Transducers; Signal Processing; Durability Testing
Event Title:2nd International Conference on System-Integrated Intelligence: New Challenges for Product and Production Engineering
Event Location:Bremen, Germany
Event Type:international Conference
Event Dates:02.-04. July 2014
HGF - Research field:Aeronautics, Space and Transport
HGF - Program:Aeronautics
HGF - Program Themes:fixed-wing aircraft
DLR - Research area:Aeronautics
DLR - Program:L AR - Aircraft Research
DLR - Research theme (Project):L - Structures and Materials (old)
Location: Braunschweig
Institutes and Institutions:Institute of Composite Structures and Adaptive Systems > Multifunctional Materials
Deposited By: Moix-Bonet, Maria
Deposited On:13 Jun 2016 08:09
Last Modified:20 Jun 2021 15:47

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