Microablation with ultrashort laser pulses

Abstract

This paper reports the micro machining results of different materials (AI, Si, InP and fused silica) using a Ti:sapphire laser at the wavelength of 800 and 267 nm with variable pulse lengths in the range from 100 fs to lo ps. The hole arrays with a diameter up to a few µm through microdrilling are presented. We discussed how an effective suppression of the thermal diffusion inside the ablated materials and an effective microablation could be realized. If the laser fluence is taken only slightly above the threshold, a hole array can be drilled with diameters even smaller than the wavelength of the laser. Some examples are presented in the paper.