Modelling of Bond Formation during Overprinting of PEEK Laminates

Abstract

The rapid technological progress of large-scale CNC (computer numerical control) systems for Screw Extrusion Additive Manufacturing (SEAM) has made the overprinting of composite laminates a much-discussed topic. It offers the potential to efficiently produce functionalised high-performance structures. However, bonding the 3D-printed structure to the laminate has proven to be a critical point. In particular, the bonding mechanisms must be precisely understood and controlled to ensure in situ bonding. This work investigates the applicability of healing models from 3D printing to the overprinting of thermoplastic laminates using semi-crystalline, high-performance material like PEEK (polyether ether ketone). For this purpose, a simulation methodology for predicting the bonding behaviour is developed and tested using experimental data from a previous study. The simulation consists of a transient heat analysis and a diffusion healing model. Using this model, a qualitative prediction of the bond strength could be made by considering the influence of wetting. It was shown that the thermal history of the interface and, in particular, the tolerance of the deposition of the first layer are decisive for in situ bonding. The results show basic requirements for future process and component developments and should further advance the maturation of overprinting.