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Mechanical analysis of a Solar Array hinge based on a 180 folded flexible printed circuit board

Bartsch, Felix Yves und Seefeldt, Patric und Wippermann, Torben und Reershemius, Siebo (2022) Mechanical analysis of a Solar Array hinge based on a 180 folded flexible printed circuit board. Acta Astronautica, Seiten 269-276. Elsevier. doi: 10.1016/j.actaastro.2021.12.035. ISSN 0094-5765.

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Kurzfassung

Flexible Printed Circuit Boards (Flex PCB) are commonly used for the electrical routing on spacecrafts (S/C). The implementation of Flex PCB as structural material and harness for the Gossamer Solar Array (GoSolAr) is currently studied by the German Aerospace Center (DLR). The Flex PCB as well as the other parts of the array are folded and stowed into a small volume for transport into space and deployed once the spacecraft starts operating. The folding areas, also referred to as hinge, are subject of this paper. The hinges and their design have major impact on the required deployment force and geometry. The aim is to get a better understanding of the relevant parameters, which are the deployment force, the angles between photovoltaic generators and the deployed distance. Deployment experiments were carried out on four different design options, which were then compared to each other with respect to their deployment behaviour. Important aspects for this evaluation were the controllability during the deployment and the force required for tensioning the array. Main differences of the evaluated designs were the amount of elastic deformation energy stored in the different configurations (stowed and deployed). The experiments revealed that a design, which has its minimum of elastic deformation energy in stowed configuration is beneficial to be used for GoSolAr. Furthermore, a numerical model of the hinge based on the FEM is introduced. The experiments were used to correlate the model. This model can be further used for design studies and optimization. The design of Flex PCB as hinges adds a mechanical function to its otherwise only electrical purpose and therefore opens a whole new field of applications, especially for thin film and lightweight structures.

elib-URL des Eintrags:https://elib.dlr.de/185569/
Dokumentart:Zeitschriftenbeitrag
Titel:Mechanical analysis of a Solar Array hinge based on a 180 folded flexible printed circuit board
Autoren:
AutorenInstitution oder E-Mail-AdresseAutoren-ORCID-iDORCID Put Code
Bartsch, Felix YvesFelix.Bartsch (at) dlr.dehttps://orcid.org/0000-0002-0233-0391NICHT SPEZIFIZIERT
Seefeldt, PatricPatric.Seefeldt (at) dlr.dehttps://orcid.org/0000-0002-2067-9458NICHT SPEZIFIZIERT
Wippermann, TorbenTorben.Wippermann (at) dlr.dehttps://orcid.org/0000-0002-0354-6557NICHT SPEZIFIZIERT
Reershemius, SieboSiebo.Reershemius (at) dlr.dehttps://orcid.org/0000-0003-1860-2758NICHT SPEZIFIZIERT
Datum:April 2022
Erschienen in:Acta Astronautica
Referierte Publikation:Ja
Open Access:Nein
Gold Open Access:Nein
In SCOPUS:Ja
In ISI Web of Science:Ja
DOI:10.1016/j.actaastro.2021.12.035
Seitenbereich:Seiten 269-276
Verlag:Elsevier
ISSN:0094-5765
Status:veröffentlicht
Stichwörter:FlexPCB, GoSolAr, PV Array
HGF - Forschungsbereich:Luftfahrt, Raumfahrt und Verkehr
HGF - Programm:Raumfahrt
HGF - Programmthema:Technik für Raumfahrtsysteme
DLR - Schwerpunkt:Raumfahrt
DLR - Forschungsgebiet:R SY - Technik für Raumfahrtsysteme
DLR - Teilgebiet (Projekt, Vorhaben):R - GoSolAr (Gossamer Solar Array)
Standort: Bremen
Institute & Einrichtungen:Institut für Raumfahrtsysteme > Mechanik und Thermalsysteme
Hinterlegt von: Reershemius, Siebo
Hinterlegt am:09 Mär 2022 10:52
Letzte Änderung:09 Mär 2022 10:52

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