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Thermal Stability of Laser Welded Thermocouple Contacts to Si for High Temperature Thermal Sensor Application

Ernst, H. and Müller, E. and Kaysser, W.A. (2000) Thermal Stability of Laser Welded Thermocouple Contacts to Si for High Temperature Thermal Sensor Application. In: Microelectronics Reliability (special issue), 40, pp. 1683-1688. Elsevier Science Ltd., Oxford, UK. 11th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2000), Dresden, 06.10.2000.

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Item URL in elib:https://elib.dlr.de/17130/
Document Type:Conference or Workshop Item (Paper)
Additional Information: LIDO-Berichtsjahr=2000,
Title:Thermal Stability of Laser Welded Thermocouple Contacts to Si for High Temperature Thermal Sensor Application
Authors:
AuthorsInstitution or Email of AuthorsAuthors ORCID iD
Ernst, H.UNSPECIFIEDUNSPECIFIED
Müller, E.UNSPECIFIEDUNSPECIFIED
Kaysser, W.A.UNSPECIFIEDUNSPECIFIED
Date:2000
Journal or Publication Title:Microelectronics Reliability (special issue)
Open Access:No
Gold Open Access:No
In SCOPUS:No
In ISI Web of Science:No
Volume:40
Page Range:pp. 1683-1688
Publisher:Elsevier Science Ltd., Oxford, UK
Series Name:8-10
Status:Published
Event Title:11th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2000), Dresden, 06.10.2000
HGF - Research field:Aeronautics, Space and Transport (old)
HGF - Program:Aeronautics
HGF - Program Themes:other
DLR - Research area:Aeronautics
DLR - Program:L TT - Triebwerkstechnologien
DLR - Research theme (Project):UNSPECIFIED
Location: Köln-Porz
Institutes and Institutions:Institute of Materials Research
Deposited By: DLR-Beauftragter, elib
Deposited On:16 Sep 2005
Last Modified:14 Jan 2010 17:14

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