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Adhesion of Multifunctional Substrates for Integrated Cure Monitoring Film Sensors to Carbon Fiber Reinforced Polymers

Kyriazis, Alexander and Asali, Kais and Sinapius, Michael and Rager, Korbinian and Dietzel, Andreas (2020) Adhesion of Multifunctional Substrates for Integrated Cure Monitoring Film Sensors to Carbon Fiber Reinforced Polymers. Journal of Composites Science, 4 (3), p. 138. Multidisciplinary Digital Publishing Institute (MDPI). doi: 10.3390/jcs4030138. ISSN 2504-477X.

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Official URL: https://www.mdpi.com/2504-477X/4/3/138/htm

Abstract

During fiber composite production, the quality of the manufactured parts can be assured by measuring the progress of the curing reaction. Dielectric film sensors are particularly suitable for this measurement task, as they can quantify the degree of curing very specifically and locally. These sensors are usually manufactured on PI films, which can lead to delaminations after integration. Other authors report that this negative influence can be reduced by miniaturization and a suitable shaping of the sensors. This article pursues as an alternative, a novel approach to achieve a material closure instead of a geometrically generated form closure by choosing suitable thermoplastic materials. Thermoplastic films made of PEI, PES and PA6 are proposed as carrier substrates for thin film sensors. They are investigated with regard to their mechanical effects in FRP. The experiments show that the integration of PES and PEI in FRP has the best shear strength, but PA6 leads to a higher critical energy release rate during crack propagation in mode I. For PI, a locally strongly scattering critical energy release rate was observed. Neither in tensile nor in Compression After Impact (CAI) tests a significant influence of the films on these characteristic values could be proven.

Item URL in elib:https://elib.dlr.de/137121/
Document Type:Article
Title:Adhesion of Multifunctional Substrates for Integrated Cure Monitoring Film Sensors to Carbon Fiber Reinforced Polymers
Authors:
AuthorsInstitution or Email of AuthorsAuthor's ORCID iD
Kyriazis, Alexandera.kyriazis (at) tu-braunschweig.deUNSPECIFIED
Asali, Kaisk.asali (at) tu-braunschweig.deUNSPECIFIED
Sinapius, MichaelMichael.Sinapius (at) dlr.deUNSPECIFIED
Rager, Korbiniank.rager (at) tu-braunschweig.deUNSPECIFIED
Dietzel, Andreasa.dietzel (at) tu-braunschweig.deUNSPECIFIED
Date:2020
Journal or Publication Title:Journal of Composites Science
Refereed publication:Yes
Open Access:Yes
Gold Open Access:Yes
In SCOPUS:No
In ISI Web of Science:Yes
Volume:4
DOI :10.3390/jcs4030138
Page Range:p. 138
Publisher:Multidisciplinary Digital Publishing Institute (MDPI)
ISSN:2504-477X
Status:Published
Keywords:fiber reinforced polymer; sensor integration; interdigital sensor; curing process monitoring; epoxy; curing; film sensor; flexible sensor; thermoplast
HGF - Research field:Aeronautics, Space and Transport
HGF - Program:Aeronautics
HGF - Program Themes:fixed-wing aircraft
DLR - Research area:Aeronautics
DLR - Program:L AR - Aircraft Research
DLR - Research theme (Project):L - Structures and Materials (old)
Location: Braunschweig
Institutes and Institutions:Institute of Composite Structures and Adaptive Systems > Functional Lightweight Structures
Deposited By: Schlegel, Linda
Deposited On:09 Nov 2020 08:51
Last Modified:11 Jun 2021 04:13

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