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Cu as potential contacting solution for Mg2Si(1-x)Snx based TEG

Ayachi, Sahar and Castillo-Hernandez, Gustavo and Tumminello, Silvana and de Boor, Johannes and Müller, Eckhard (2019) Cu as potential contacting solution for Mg2Si(1-x)Snx based TEG. The 38th International Conference on Thermoelectrics (ICT 2019) and The 4th Asian Conference on Thermoelectrics, 30. Juni - 05. Jul. 2019, Gyeongju, Rep. of Korea.

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Item URL in elib:https://elib.dlr.de/130668/
Document Type:Conference or Workshop Item (Speech)
Title:Cu as potential contacting solution for Mg2Si(1-x)Snx based TEG
Authors:
AuthorsInstitution or Email of AuthorsAuthors ORCID iD
Ayachi, SaharGerman aerospace center, institute of materials research, köln, germanyUNSPECIFIED
Castillo-Hernandez, GustavoGerman aerospace center, institute of materials research, köln, germanyUNSPECIFIED
Tumminello, SilvanaGerman aerospace center, institute of materials research, köln, germanyUNSPECIFIED
de Boor, Johannesgerman aerospace center, institute of materials research, köln, germanyhttps://orcid.org/0000-0002-1868-3167
Müller, EckhardGerman aerospace center, Institute of materials research, Köln, Germany and Institute for inorganic and analytical chemistry, Justus-Liebig-Universität Gießen, Heinrich-Buff-Ring 58, 35392 Gießen, GermanyUNSPECIFIED
Date:2019
Refereed publication:Yes
Open Access:No
Gold Open Access:No
In SCOPUS:No
In ISI Web of Science:No
Status:Published
Keywords:Cu; potential; contacting; Mg2Si(1-x)Snx; TEG
Event Title:The 38th International Conference on Thermoelectrics (ICT 2019) and The 4th Asian Conference on Thermoelectrics
Event Location:Gyeongju, Rep. of Korea
Event Type:international Conference
Event Dates:30. Juni - 05. Jul. 2019
HGF - Research field:Aeronautics, Space and Transport
HGF - Program:Space
HGF - Program Themes:Space Technology
DLR - Research area:Raumfahrt
DLR - Program:R SY - Technik für Raumfahrtsysteme
DLR - Research theme (Project):R - Systemtechnologien
Location: Köln-Porz
Institutes and Institutions:Institute of Materials Research > Thermoelectric Materials and Systems
Deposited By: Yasseri, Mohammad
Deposited On:15 Nov 2019 15:24
Last Modified:15 Nov 2019 15:24

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