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Digital Image Correlation Strain Measurement of Thick Adherend Shear Test Specimen Joined with an Epoxy Film Adhesive

Kosmann, Jens and Völkerink, Oliver and Schollerer, Martin and Holzhüter, Dirk and Hühne, Christian (2019) Digital Image Correlation Strain Measurement of Thick Adherend Shear Test Specimen Joined with an Epoxy Film Adhesive. International Journal of Adhesion and Adhesives (90), pp. 32-37. Elsevier. doi: 10.1016/j.ijadhadh.2019.01.024. ISSN 0143-7496.

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Official URL: https://www.sciencedirect.com/science/article/pii/S0143749619300247?via%3Dihub


Abstract Structural bonding and bonded repairs of composite materials become more and more important. Understanding the strain within the bondline leads to suitable bonding design. For new design approaches the strain distribution within the bondline has to be analyzed. Thus, often finite element analysis (FE) are used. However, a huge challenge is the availability of reliable material properties for the adhesives and their validation. Previous work has shown that it is possible to measure the small displacements resulting within thin epoxy film adhesives using high resolution digital image correlation (DIC). In this work a 2D DIC setup with a high resolution consumer camera is used to visualize the strain distribution within the bondline over the length of the joint as well as over the adhesive thickness. Therefore, single lap joints with thick aluminum adherends according to ASTM D 5656 are manufactured and tested. Local 2D DIC strain measurements are performed and analyzed. Two different camera setups are used and compared. The evaluation provides reliable material data and enables a look insight the bondline. The results of the full field strain data measured with DIC are compared with numerical simulations. Thus, material models as well as chosen parameters for the adhesive are validated. Compared to extensometers, giving only point-wise information for fixed measuring points, the DIC allows a virtual point-wise inspection along the complete bondline. Furthermore, it allows measuring close to the bondline to reduce the influence of adherend deformation.

Item URL in elib:https://elib.dlr.de/126775/
Document Type:Article
Title:Digital Image Correlation Strain Measurement of Thick Adherend Shear Test Specimen Joined with an Epoxy Film Adhesive
AuthorsInstitution or Email of AuthorsAuthor's ORCID iD
Kosmann, Jensjens.kosmann (at) dlr.dehttps://orcid.org/0000-0002-2225-4832
Völkerink, Oliveroliver.voelkerink (at) dlr.dehttps://orcid.org/0000-0002-9589-1963
Schollerer, MartinMartin.Schollerer (at) dlr.dehttps://orcid.org/0000-0001-7015-9461
Holzhüter, Dirkdirk.holzhueter (at) dlr.dehttps://orcid.org/0000-0003-1001-2366
Hühne, ChristianChristian.Huehne (at) dlr.dehttps://orcid.org/0000-0002-2218-1223
Date:April 2019
Journal or Publication Title:International Journal of Adhesion and Adhesives
Refereed publication:Yes
Open Access:Yes
Gold Open Access:No
In ISI Web of Science:Yes
DOI :10.1016/j.ijadhadh.2019.01.024
Page Range:pp. 32-37
Keywords:Adhesive bonding; Digital image correlation (DIC); Epoxides (A); Destructive testing (C); Mechanical properties of adhesives (C)
HGF - Research field:Aeronautics, Space and Transport
HGF - Program:Aeronautics
HGF - Program Themes:fixed-wing aircraft
DLR - Research area:Aeronautics
DLR - Program:L AR - Aircraft Research
DLR - Research theme (Project):L - Simulation and Validation (old), L - Structures and Materials (old)
Location: Braunschweig
Institutes and Institutions:Institute of Composite Structures and Adaptive Systems > Functional Lightweight Structures
Deposited By: Kosmann, Jens
Deposited On:06 Jul 2019 12:29
Last Modified:01 Mar 2021 03:00

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