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3D-printing with thermoplastics and continuous carbon fiber

Titze, Maik and Kletz, Björn Timo and Riemenschneider, Johannes (2018) 3D-printing with thermoplastics and continuous carbon fiber. Symposium Ligthweight Design in Product Development 2018 (LWD-PD18), 2018-06-14 - 2018-06-15, Zurich, Switzerland.

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Abstract

Using standard filaments and standard fibers is key to enable industrial scale 3D-printing with continuous carbon fiber reinforcement. The novel printing head for Additive Composite Structures (AddCompSTM) serves this task as one element along the completely new developed process chain for continuous fiber reinforced 3D-printing. Both the AddCompS printing head and the process chain are described within this paper.

Item URL in elib:https://elib.dlr.de/120467/
Document Type:Conference or Workshop Item (Speech)
Title:3D-printing with thermoplastics and continuous carbon fiber
Authors:
AuthorsInstitution or Email of AuthorsAuthor's ORCID iDORCID Put Code
Titze, MaikUNSPECIFIEDhttps://orcid.org/0000-0001-5223-1538UNSPECIFIED
Kletz, Björn TimoUNSPECIFIEDhttps://orcid.org/0000-0002-3744-759XUNSPECIFIED
Riemenschneider, JohannesUNSPECIFIEDhttps://orcid.org/0000-0001-5485-8326UNSPECIFIED
Date:June 2018
Refereed publication:No
Open Access:Yes
Gold Open Access:No
In SCOPUS:No
In ISI Web of Science:No
Status:Published
Keywords:Fused Filament Fabrication , Fused Deposition Modeling , Additive Extrusion , Continuous Carbon Fiber Reinforced Plastics , Additive Manufacturing
Event Title:Symposium Ligthweight Design in Product Development 2018 (LWD-PD18)
Event Location:Zurich, Switzerland
Event Type:international Conference
Event Start Date:14 June 2018
Event End Date:15 June 2018
HGF - Research field:Aeronautics, Space and Transport
HGF - Program:Aeronautics
HGF - Program Themes:fixed-wing aircraft
DLR - Research area:Aeronautics
DLR - Program:L AR - Aircraft Research
DLR - Research theme (Project):L - Structures and Materials (old)
Location: Braunschweig
Institutes and Institutions:Institute of Composite Structures and Adaptive Systems > Adaptronics
Deposited By: Titze, Maik
Deposited On:25 Jun 2018 06:33
Last Modified:24 Apr 2024 20:24

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