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Electrical and thermal contact resistances of diffusion bonded interfaces

Sottong, Reinhard and Kolb, Hendrik and Müller, Eckhard (2016) Electrical and thermal contact resistances of diffusion bonded interfaces. 612th WE-Heraeus-Seminar Electrons and photons, 03.-06. Apr. 2016, Dresden, Deutschland.

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Item URL in elib:https://elib.dlr.de/108787/
Document Type:Conference or Workshop Item (Poster)
Title:Electrical and thermal contact resistances of diffusion bonded interfaces
Authors:
AuthorsInstitution or Email of AuthorsAuthors ORCID iD
Sottong, ReinhardGerman aerospace center, Institute of materials research, Köln, GermanyUNSPECIFIED
Kolb, HendrikGerman aerospace center, Institute of materials research, Köln, GermanyUNSPECIFIED
Müller, EckhardGerman aerospace center, Institute of materials research, Köln, Germany and Justus Liebig university Giessen, Institute of inorganic and analytical chemistry, 35392 Giessen, GermanyUNSPECIFIED
Date:4 April 2016
Refereed publication:No
Open Access:No
Gold Open Access:No
In SCOPUS:No
In ISI Web of Science:No
Status:Published
Keywords:Thermal contact resistance
Event Title:612th WE-Heraeus-Seminar Electrons and photons
Event Location:Dresden, Deutschland
Event Type:international Conference
Event Dates:03.-06. Apr. 2016
Organizer:Heraeus Stiftung
HGF - Research field:Aeronautics, Space and Transport
HGF - Program:Transport
HGF - Program Themes:Terrestrial Vehicles (old)
DLR - Research area:Transport
DLR - Program:V BF - Bodengebundene Fahrzeuge
DLR - Research theme (Project):V - NGC-Antriebsstrang (old)
Location: Köln-Porz
Institutes and Institutions:Institute of Materials Research > Thermoelectric Materials and Systems
Deposited By: Yasseri, Mohammad
Deposited On:05 Dec 2016 07:13
Last Modified:05 Dec 2016 07:13

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