Electrical and thermal contact resistances of diffusion bonded interfaces

Sottong, Reinhard and Kolb, Hendrik and Müller, Eckhard (2016) Electrical and thermal contact resistances of diffusion bonded interfaces. 612th WE-Heraeus-Seminar Electrons and photons, 03.-06. Apr. 2016, Dresden, Deutschland.

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Item URL in elib:

https://elib.dlr.de/108787/

Document Type:

Conference or Workshop Item (Poster)

Title:

Electrical and thermal contact resistances of diffusion bonded interfaces

Authors:

Authors	Institution or Email of Authors	Author's ORCID iD
Sottong, Reinhard	German aerospace center, Institute of materials research, Köln, Germany	UNSPECIFIED
Kolb, Hendrik	German aerospace center, Institute of materials research, Köln, Germany	UNSPECIFIED
Müller, Eckhard	German aerospace center, Institute of materials research, Köln, Germany and Justus Liebig university Giessen, Institute of inorganic and analytical chemistry, 35392 Giessen, Germany	UNSPECIFIED

Date:

4 April 2016

Refereed publication:

Open Access:

Gold Open Access:

In SCOPUS:

In ISI Web of Science:

Status:

Published

Keywords:

Thermal contact resistance

Event Title:

612th WE-Heraeus-Seminar Electrons and photons

Event Location:

Dresden, Deutschland

Event Type:

international Conference

Event Dates:

03.-06. Apr. 2016

Organizer:

Heraeus Stiftung

HGF - Research field:

Aeronautics, Space and Transport

HGF - Program:

Transport

HGF - Program Themes:

Terrestrial Vehicles (old)

DLR - Research area:

Transport

DLR - Program:

V BF - Bodengebundene Fahrzeuge

DLR - Research theme (Project):

V - NGC-Antriebsstrang (old)

Location:

Köln-Porz

Institutes and Institutions:

Institute of Materials Research > Thermoelectric Materials and Systems

Deposited By:

Yasseri, Mohammad

Deposited On:

05 Dec 2016 07:13

Last Modified:

05 Dec 2016 07:13

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