Impact of the film thickness and substrate on the thermopower measurement of thermoelectric films by the potential-Seebeck microprobe (PSM)

Zhou, Aijun and Wang, Weihang and Yao, Xu and Yang, Bin and Li, Jingze and Zhao, Qiang and Wang, Chao and Xu, Dongyan and Ziolkowski, Pawel and Müller, Eckhard (2016) Impact of the film thickness and substrate on the thermopower measurement of thermoelectric films by the potential-Seebeck microprobe (PSM). Applied Thermal Engineering, 107, pp. 552-559. Elsevier. DOI: 10.1016/j.applthermaleng.2016.05.037 ISSN 1359-4311

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Official URL: http://dx.doi.org/10.1016/j.applthermaleng.2016.05.037

Abstract

Thermopower is a key parameter for thermoelectric (TE) materials. Compared to bulk materials, thermopower determination for TE films is challenging especially for those grown on electrically conductive substrates. This work demonstrates the feasibility of the on-substrate thermopower measurement for TE films by the unique potential-Seebeck microprobe (PSM). Thermopower measurements were conducted on the electroplated Bi2Te3 films with different thicknesses prepared on Au-coated Si and quartz substrates in order to reveal the impact of the film thickness and substrate on the measurement accuracy. It is found that the thermopower (Sm) measured on the Bi2Te3 film grown on Si/Au substrates tends to deviate significantly from the real value if the thickness is smaller than 12 m. Above 12 m, no thickness dependence was observed and reliable Sm can be obtained for the Bi2Te3 films. Results on quartz/Au substrates show similar thickness dependence for Sm, but the derived values are much lower than those obtained on Si/Au substrates. Finite element method (FEM) simulations are performed to interpret the measurement discrepancy as well as the impact of the film thickness and substrate on the thermopower measurement by investigating the detailed temperature and potential profiles in the samples.

Item URL in elib:

https://elib.dlr.de/108636/

Document Type:

Article

Title:

Impact of the film thickness and substrate on the thermopower measurement of thermoelectric films by the potential-Seebeck microprobe (PSM)

Authors:

Authors	Institution or Email of Authors	Authors ORCID iD
Zhou, Aijun	State key laboratory of electronic thin films and integrated devices, School of microelectronics and solid-state electronics, University of electronic science and technology of China, Chengdu 610054, China	UNSPECIFIED
Wang, Weihang	State key laboratory of electronic thin films and integrated devices, School of microelectronics and solid-state electronics, University of electronic science and technology of China, Chengdu 610054, China	UNSPECIFIED
Yao, Xu	State key laboratory of electronic thin films and integrated devices, School of microelectronics and solid-state electronics, University of electronic science and technology of China, Chengdu 610054, China	UNSPECIFIED
Yang, Bin	State key laboratory of electronic thin films and integrated devices, School of microelectronics and solid-state electronics, University of electronic science and technology of China, Chengdu 610054, China	UNSPECIFIED
Li, Jingze	State key laboratory of electronic thin films and integrated devices, School of microelectronics and solid-state electronics, University of electronic science and technology of China, Chengdu 610054, China	UNSPECIFIED
Zhao, Qiang	State key laboratory of electronic thin films and integrated devices, School of microelectronics and solid-state electronics, University of electronic science and technology of China, Chengdu 610054, China	UNSPECIFIED
Wang, Chao	State key laboratory of electronic thin films and integrated devices, School of microelectronics and solid-state electronics, University of electronic science and technology of China, Chengdu 610054, China	UNSPECIFIED
Xu, Dongyan	Department of mechanical and automation engineering, the Chinese university of Hong Kong, Shatin, new territories, Hong Kong special administrative region and Shenzhen research institute, the Chinese university of Hong Kong, Shenzhen 518057, China	UNSPECIFIED
Ziolkowski, Pawel	German aerospace center, Institute of materials research, Köln, Germany	UNSPECIFIED
Müller, Eckhard	German aerospace center, Institute of materials research, Köln, Germany and Justus Liebig university Giessen, Institute of inorganic and analytical chemistry, 35392 Giessen, Germany	UNSPECIFIED

Date:

5 May 2016

Journal or Publication Title:

Applied Thermal Engineering

Refereed publication:

Yes

Open Access:

Gold Open Access:

In SCOPUS:

Yes

In ISI Web of Science:

Yes

Volume:

107

DOI :

10.1016/j.applthermaleng.2016.05.037

Page Range:

pp. 552-559

Publisher:

Elsevier

ISSN:

1359-4311

Status:

Published

Keywords:

Thermopower, Thermoelectric films, Potential-Seebeck microprobe, FEM simulation, Substrate, Film thickness

HGF - Research field:

Aeronautics, Space and Transport

HGF - Program:

Aeronautics

HGF - Program Themes:

propulsion systems

DLR - Research area:

Aeronautics

DLR - Program:

L ER - Engine Research

DLR - Research theme (Project):

L - Turbine Technologies

Location:

Köln-Porz

Institutes and Institutions:

Institute of Materials Research > Thermoelectric Materials and Systems

Deposited By:

Yasseri, Mohammad

Deposited On:

01 Dec 2016 09:53

Last Modified:

06 Sep 2019 15:16

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