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Impact of the film thickness and substrate on the thermopower measurement of thermoelectric films by the potential-Seebeck microprobe (PSM)

Zhou, Aijun and Wang, Weihang and Yao, Xu and Yang, Bin and Li, Jingze and Zhao, Qiang and Wang, Chao and Xu, Dongyan and Ziolkowski, Pawel and Müller, Eckhard (2016) Impact of the film thickness and substrate on the thermopower measurement of thermoelectric films by the potential-Seebeck microprobe (PSM). Applied Thermal Engineering, 107, pp. 552-559. Elsevier. DOI: 10.1016/j.applthermaleng.2016.05.037 ISSN 1359-4311

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Official URL: http://dx.doi.org/10.1016/j.applthermaleng.2016.05.037

Abstract

Thermopower is a key parameter for thermoelectric (TE) materials. Compared to bulk materials, thermopower determination for TE films is challenging especially for those grown on electrically conductive substrates. This work demonstrates the feasibility of the on-substrate thermopower measurement for TE films by the unique potential-Seebeck microprobe (PSM). Thermopower measurements were conducted on the electroplated Bi2Te3 films with different thicknesses prepared on Au-coated Si and quartz substrates in order to reveal the impact of the film thickness and substrate on the measurement accuracy. It is found that the thermopower (Sm) measured on the Bi2Te3 film grown on Si/Au substrates tends to deviate significantly from the real value if the thickness is smaller than 12 m. Above 12 m, no thickness dependence was observed and reliable Sm can be obtained for the Bi2Te3 films. Results on quartz/Au substrates show similar thickness dependence for Sm, but the derived values are much lower than those obtained on Si/Au substrates. Finite element method (FEM) simulations are performed to interpret the measurement discrepancy as well as the impact of the film thickness and substrate on the thermopower measurement by investigating the detailed temperature and potential profiles in the samples.

Item URL in elib:https://elib.dlr.de/108636/
Document Type:Article
Title:Impact of the film thickness and substrate on the thermopower measurement of thermoelectric films by the potential-Seebeck microprobe (PSM)
Authors:
AuthorsInstitution or Email of AuthorsAuthors ORCID iD
Zhou, AijunState key laboratory of electronic thin films and integrated devices, School of microelectronics and solid-state electronics, University of electronic science and technology of China, Chengdu 610054, ChinaUNSPECIFIED
Wang, WeihangState key laboratory of electronic thin films and integrated devices, School of microelectronics and solid-state electronics, University of electronic science and technology of China, Chengdu 610054, ChinaUNSPECIFIED
Yao, XuState key laboratory of electronic thin films and integrated devices, School of microelectronics and solid-state electronics, University of electronic science and technology of China, Chengdu 610054, ChinaUNSPECIFIED
Yang, BinState key laboratory of electronic thin films and integrated devices, School of microelectronics and solid-state electronics, University of electronic science and technology of China, Chengdu 610054, ChinaUNSPECIFIED
Li, JingzeState key laboratory of electronic thin films and integrated devices, School of microelectronics and solid-state electronics, University of electronic science and technology of China, Chengdu 610054, ChinaUNSPECIFIED
Zhao, QiangState key laboratory of electronic thin films and integrated devices, School of microelectronics and solid-state electronics, University of electronic science and technology of China, Chengdu 610054, ChinaUNSPECIFIED
Wang, ChaoState key laboratory of electronic thin films and integrated devices, School of microelectronics and solid-state electronics, University of electronic science and technology of China, Chengdu 610054, ChinaUNSPECIFIED
Xu, DongyanDepartment of mechanical and automation engineering, the Chinese university of Hong Kong, Shatin, new territories, Hong Kong special administrative region and Shenzhen research institute, the Chinese university of Hong Kong, Shenzhen 518057, ChinaUNSPECIFIED
Ziolkowski, PawelGerman aerospace center, Institute of materials research, Köln, GermanyUNSPECIFIED
Müller, EckhardGerman aerospace center, Institute of materials research, Köln, Germany and Justus Liebig university Giessen, Institute of inorganic and analytical chemistry, 35392 Giessen, GermanyUNSPECIFIED
Date:5 May 2016
Journal or Publication Title:Applied Thermal Engineering
Refereed publication:Yes
Open Access:No
Gold Open Access:No
In SCOPUS:Yes
In ISI Web of Science:Yes
Volume:107
DOI :10.1016/j.applthermaleng.2016.05.037
Page Range:pp. 552-559
Publisher:Elsevier
ISSN:1359-4311
Status:Published
Keywords:Thermopower, Thermoelectric films, Potential-Seebeck microprobe, FEM simulation, Substrate, Film thickness
HGF - Research field:Aeronautics, Space and Transport
HGF - Program:Aeronautics
HGF - Program Themes:propulsion systems
DLR - Research area:Aeronautics
DLR - Program:L ER - Engine Research
DLR - Research theme (Project):L - Turbine Technologies
Location: Köln-Porz
Institutes and Institutions:Institute of Materials Research > Thermoelectric Materials and Systems
Deposited By: Yasseri, Mohammad
Deposited On:01 Dec 2016 09:53
Last Modified:06 Sep 2019 15:16

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