Impact of the film thickness and substrate on the thermopower measurement of thermoelectric films by the potential-Seebeck microprobe (PSM)

Zhou, Aijun und Wang, Weihang und Yao, Xu und Yang, Bin und Li, Jingze und Zhao, Qiang und Wang, Chao und Xu, Dongyan und Ziolkowski, Pawel und Müller, Eckhard (2016) Impact of the film thickness and substrate on the thermopower measurement of thermoelectric films by the potential-Seebeck microprobe (PSM). Applied Thermal Engineering, 107, Seiten 552-559. Elsevier. doi: 10.1016/j.applthermaleng.2016.05.037. ISSN 1359-4311.

Dieses Archiv kann nicht den Volltext zur Verfügung stellen.

Offizielle URL: http://dx.doi.org/10.1016/j.applthermaleng.2016.05.037

Kurzfassung

Thermopower is a key parameter for thermoelectric (TE) materials. Compared to bulk materials, thermopower determination for TE films is challenging especially for those grown on electrically conductive substrates. This work demonstrates the feasibility of the on-substrate thermopower measurement for TE films by the unique potential-Seebeck microprobe (PSM). Thermopower measurements were conducted on the electroplated Bi2Te3 films with different thicknesses prepared on Au-coated Si and quartz substrates in order to reveal the impact of the film thickness and substrate on the measurement accuracy. It is found that the thermopower (Sm) measured on the Bi2Te3 film grown on Si/Au substrates tends to deviate significantly from the real value if the thickness is smaller than 12 m. Above 12 m, no thickness dependence was observed and reliable Sm can be obtained for the Bi2Te3 films. Results on quartz/Au substrates show similar thickness dependence for Sm, but the derived values are much lower than those obtained on Si/Au substrates. Finite element method (FEM) simulations are performed to interpret the measurement discrepancy as well as the impact of the film thickness and substrate on the thermopower measurement by investigating the detailed temperature and potential profiles in the samples.

elib-URL des Eintrags:

https://elib.dlr.de/108636/

Dokumentart:

Zeitschriftenbeitrag

Titel:

Impact of the film thickness and substrate on the thermopower measurement of thermoelectric films by the potential-Seebeck microprobe (PSM)

Autoren:

Autoren	Institution oder E-Mail-Adresse	Autoren-ORCID-iD	ORCID Put Code
Zhou, Aijun	State key laboratory of electronic thin films and integrated devices, School of microelectronics and solid-state electronics, University of electronic science and technology of China, Chengdu 610054, China	NICHT SPEZIFIZIERT	NICHT SPEZIFIZIERT
Wang, Weihang	State key laboratory of electronic thin films and integrated devices, School of microelectronics and solid-state electronics, University of electronic science and technology of China, Chengdu 610054, China	NICHT SPEZIFIZIERT	NICHT SPEZIFIZIERT
Yao, Xu	State key laboratory of electronic thin films and integrated devices, School of microelectronics and solid-state electronics, University of electronic science and technology of China, Chengdu 610054, China	NICHT SPEZIFIZIERT	NICHT SPEZIFIZIERT
Yang, Bin	State key laboratory of electronic thin films and integrated devices, School of microelectronics and solid-state electronics, University of electronic science and technology of China, Chengdu 610054, China	NICHT SPEZIFIZIERT	NICHT SPEZIFIZIERT
Li, Jingze	State key laboratory of electronic thin films and integrated devices, School of microelectronics and solid-state electronics, University of electronic science and technology of China, Chengdu 610054, China	NICHT SPEZIFIZIERT	NICHT SPEZIFIZIERT
Zhao, Qiang	State key laboratory of electronic thin films and integrated devices, School of microelectronics and solid-state electronics, University of electronic science and technology of China, Chengdu 610054, China	NICHT SPEZIFIZIERT	NICHT SPEZIFIZIERT
Wang, Chao	State key laboratory of electronic thin films and integrated devices, School of microelectronics and solid-state electronics, University of electronic science and technology of China, Chengdu 610054, China	NICHT SPEZIFIZIERT	NICHT SPEZIFIZIERT
Xu, Dongyan	Department of mechanical and automation engineering, the Chinese university of Hong Kong, Shatin, new territories, Hong Kong special administrative region and Shenzhen research institute, the Chinese university of Hong Kong, Shenzhen 518057, China	NICHT SPEZIFIZIERT	NICHT SPEZIFIZIERT
Ziolkowski, Pawel	German aerospace center, Institute of materials research, Köln, Germany	NICHT SPEZIFIZIERT	NICHT SPEZIFIZIERT
Müller, Eckhard	German aerospace center, Institute of materials research, Köln, Germany and Justus Liebig university Giessen, Institute of inorganic and analytical chemistry, 35392 Giessen, Germany	NICHT SPEZIFIZIERT	NICHT SPEZIFIZIERT

Datum:

5 Mai 2016

Erschienen in:

Applied Thermal Engineering

Referierte Publikation:

Open Access:

Nein

Gold Open Access:

Nein

In SCOPUS:

In ISI Web of Science:

Band:

107

DOI:

10.1016/j.applthermaleng.2016.05.037

Seitenbereich:

Seiten 552-559

Verlag:

Elsevier

ISSN:

1359-4311

Status:

veröffentlicht

Stichwörter:

Thermopower, Thermoelectric films, Potential-Seebeck microprobe, FEM simulation, Substrate, Film thickness

HGF - Forschungsbereich:

Luftfahrt, Raumfahrt und Verkehr

HGF - Programm:

Luftfahrt

HGF - Programmthema:

Antriebssysteme

DLR - Schwerpunkt:

Luftfahrt

DLR - Forschungsgebiet:

L ER - Engine Research

DLR - Teilgebiet (Projekt, Vorhaben):

L - Turbinentechnologien (alt)

Standort:

Köln-Porz

Institute & Einrichtungen:

Institut für Werkstoff-Forschung > Thermoelektrische Materialien und Systeme

Hinterlegt von:

Yasseri, Mohammad

Hinterlegt am:

01 Dez 2016 09:53

Letzte Änderung:

06 Sep 2019 15:16

Nur für Mitarbeiter des Archivs: Kontrollseite des Eintrags