Beutel, T. and Leester-Schädel, M. and Wierach, Peter and Sinapius, Michael and Büttgenbach, S. (2010) Novel Pressure Sensor for Aerospace Purposes. Sensors and Transducers, Vol. 115 (Issue 4), pp. 11-19. ISSN 1726-5479.
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In this work, a novel silicon-based sensor for pressure and flow measurements is presented. To meet the special requirements of the aerospace industry a new piezoresistive pressure sensor with a flat surface has been developed, so that the flow is not affected by the sensor. To avoid bonding-wires on top of the sensor a special through-wafer connection is presented. By making other significant changes in the layout as well as in the micro fabrication process, a novel sensor has been created. It is robust enough to be laminated in fibre material, which opens new possibilities for measurements. With this sensor it is possible to characterize the condition of the flow near the separation point. This article describes the complete process from the development to the laminated sensor.
|Title:||Novel Pressure Sensor for Aerospace Purposes|
|Journal or Publication Title:||Sensors and Transducers|
|In ISI Web of Science:||No|
|Page Range:||pp. 11-19|
|Keywords:||Piezoresistive pressure sensor for flow characterization, Silicon membrane, Micro fabrication, Through-wafer connection|
|HGF - Research field:||Aeronautics, Space and Transport|
|HGF - Program:||Aeronautics|
|HGF - Program Themes:||Rotorcraft|
|DLR - Research area:||Aeronautics|
|DLR - Program:||L RR - Rotorcraft Research|
|DLR - Research theme (Project):||L - The Active Rotorcraft (old)|
|Institutes and Institutions:||Institute of Composite Structures and Adaptive Systems|
|Deposited By:||Isolde Böhringer-Thelen|
|Deposited On:||28 Mar 2012 08:38|
|Last Modified:||07 Feb 2013 20:08|
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