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Novel Pressure Sensor for Aerospace Purposes

Beutel, T. and Leester-Schädel, M. and Wierach, Peter and Sinapius, Michael and Büttgenbach, S. (2010) Novel Pressure Sensor for Aerospace Purposes. Sensors and Transducers, Vol. 115 (Issue 4), pp. 11-19. ISSN 1726-5479.

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In this work, a novel silicon-based sensor for pressure and flow measurements is presented. To meet the special requirements of the aerospace industry a new piezoresistive pressure sensor with a flat surface has been developed, so that the flow is not affected by the sensor. To avoid bonding-wires on top of the sensor a special through-wafer connection is presented. By making other significant changes in the layout as well as in the micro fabrication process, a novel sensor has been created. It is robust enough to be laminated in fibre material, which opens new possibilities for measurements. With this sensor it is possible to characterize the condition of the flow near the separation point. This article describes the complete process from the development to the laminated sensor.

Document Type:Article
Title:Novel Pressure Sensor for Aerospace Purposes
AuthorsInstitution or Email of Authors
Beutel, T.TU Braunschweig
Leester-Schädel, M.TU Braunschweig
Sinapius, MichaelUNSPECIFIED
Büttgenbach, S.TU Braunschweig
Date:April 2010
Journal or Publication Title:Sensors and Transducers
Refereed publication:Yes
In ISI Web of Science:No
Volume:Vol. 115
Page Range:pp. 11-19
Keywords:Piezoresistive pressure sensor for flow characterization, Silicon membrane, Micro fabrication, Through-wafer connection
HGF - Research field:Aeronautics, Space and Transport
HGF - Program:Aeronautics
HGF - Program Themes:Rotorcraft
DLR - Research area:Aeronautics
DLR - Program:L RR - Rotorcraft Research
DLR - Research theme (Project):L - The Active Rotorcraft (old)
Location: Braunschweig
Institutes and Institutions:Institute of Composite Structures and Adaptive Systems
Deposited By: Isolde Böhringer-Thelen
Deposited On:28 Mar 2012 08:38
Last Modified:07 Feb 2013 20:08

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