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High-Temperature Metallic Melts - Resistivity Intercomparison for Space Applications

Cagran, C. and Hüpf, T. and Pottlacher, G. and Lohöfer, G. (2007) High-Temperature Metallic Melts - Resistivity Intercomparison for Space Applications. International Journal of Thermophysics, 28, pp. 2176-2187. DOI: 10.1007/s10765-007-0245-4.

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Document Type:Article
Title:High-Temperature Metallic Melts - Resistivity Intercomparison for Space Applications
Authors:
AuthorsInstitution or Email of Authors
Cagran, C.Graz University, Österreich
Hüpf, T.Graz University, Österreich
Pottlacher, G.Graz University, Österreich
Lohöfer, G.UNSPECIFIED
Date:2007
Journal or Publication Title:International Journal of Thermophysics
Refereed publication:Yes
In ISI Web of Science:Yes
Volume:28
DOI:10.1007/s10765-007-0245-4
Page Range:pp. 2176-2187
Status:Published
Keywords:Copper, Density, Electrical resistivity, High temperatures, Liquid state, Nickel
HGF - Research field:Aeronautics, Space and Transport (old)
HGF - Program:Space (old)
HGF - Program Themes:W FR - Forschung unter Weltraumbedingungen (old)
DLR - Research area:Space
DLR - Program:W FR - Forschung unter Weltraumbedingungen
DLR - Research theme (Project):W - Vorhaben Materialwissenschaftliche Forschung (old)
Location: Köln-Porz
Institutes and Institutions:Institute of Materials Physics in Space > Institute of Space Simulation > Center for Solidification of Undercooled Melts (ZEUS)
Deposited By: Ingeborg Parpart
Deposited On:14 Jan 2008
Last Modified:27 Apr 2009 14:38

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