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Microablation with ultrashort laser pulses

Zhao,J, and Huettner, B, and Menschig, A, (2001) Microablation with ultrashort laser pulses. Optics & Laser Technology, 33, pp. 487-491.

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Abstract

This paper reports the micro machining results of different materials (AI, Si, InP and fused silica) using a Ti:sapphire laser at the wavelength of 800 and 267 nm with variable pulse lengths in the range from 100 fs to lo ps. The hole arrays with a diameter up to a few µm through microdrilling are presented. We discussed how an effective suppression of the thermal diffusion inside the ablated materials and an effective microablation could be realized. If the laser fluence is taken only slightly above the threshold, a hole array can be drilled with diameters even smaller than the wavelength of the laser. Some examples are presented in the paper.

Document Type:Article
Additional Information: LIDO-Berichtsjahr=2002,
Title:Microablation with ultrashort laser pulses
Authors:
AuthorsInstitution or Email of Authors
Zhao,J, UNSPECIFIED
Huettner, B, UNSPECIFIED
Menschig, A, UNSPECIFIED
Date:2001
Journal or Publication Title:Optics & Laser Technology
Refereed publication:Yes
In ISI Web of Science:Yes
Volume:33
Page Range:pp. 487-491
Status:Published
Keywords:Micromachining; Ti : sapphire laser; Microablation
HGF - Research field:other
HGF - Program:Aeronautics
HGF - Program Themes:other
DLR - Research area:no assignement
DLR - Program:L - no assignement
DLR - Research theme (Project):L - Laser Research and Technology
Location: Stuttgart
Institutes and Institutions:Institute of Technical Physics
Deposited By: Dr.rer.nat. Hans-Albert Eckel
Deposited On:16 Sep 2005
Last Modified:06 Jan 2010 14:47

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